Applied Materials: FY26 Q3 earnings call, Aug 13, 2026
On its Aug 13, 2026 earnings call (FY26 Q3), Applied Materials said 10 of the 13 words Kalshi listed; Parrot’s count agreed with all 13 settlements. Quotes below are at most 25 words each, with timed clips.
UpdatedMarkets
13 words · 10 settled yes · our count agreed on 13 of 13- Kalshi: company speakers + operator
Kalshi
backtest The probabilities on settled rows are a walk-forward backtest: the model as of before each event, computed after Parrot went live; they were not published at the time.
| Word | Result | Our count | All speakers | Agrees | Probability | Clip | Market |
|---|---|---|---|---|---|---|---|
| Supply Chain | Yes | 8 | 9 | ✓ | 87%transcripts from the transcript model | Hear it 2:42, Supply Chain | – |
| China / Chinese | Yes | 5 | 6 | ✓ | 95%transcripts from the transcript model | Hear it 22:09, China / Chinese | – |
| EPIC Center | Yes | 5 | 5 | ✓ | 77%transcripts from the transcript model | Hear it 1:15, EPIC Center | – |
| Hybrid Bonding | Yes | 4 | 5 | ✓ | 73%transcripts from the transcript model | Hear it 1:01:39, Hybrid Bonding | – |
| Epitaxy | Yes | 4 | 4 | ✓ | 42%transcripts from the transcript model | Hear it 7:33, Epitaxy | – |
| Singapore | Yes | 1 | 1 | ✓ | 53%transcripts from the transcript model | Hear it 16:55, Singapore | – |
| Agent / Agentic | Yes | 1 | 1 | ✓ | 50%transcripts from the transcript model | Hear it 32:35, Agent / Agentic | – |
| Chiplet | Yes | 1 | 1 | ✓ | 36%transcripts from the transcript model | Hear it 8:19, Chiplet | – |
| SCREEN | Yes | 1 | 1 | ✓ | 29%transcripts from the transcript model | Hear it 12:54, SCREEN | – |
| Broadcom | Yes | 1 | 1 | ✓ | 16%transcripts from the transcript model | Hear it 12:40, Broadcom | – |
| EssilorLuxottica | No | 0 | 0 | ✓ | 16%transcripts from the transcript model | – | |
| SENZ | No | 0 | 0 | ✓ | 16%transcripts from the transcript model | – | |
| Smart Glasses | No | 0 | 0 | ✓ | 16%transcripts from the transcript model | – |
Market prices are mid quotes from Kalshi and Polymarket, shown for context, may be delayed by several minutes and are not a signal. Quotes as of Oct 20, 2026 15:46 UTC.
Transcript
quotes of at most 25 wordsSpeaker-labelled transcript · Source and credits · Used to count words; quotes of at most 25 words.
4 matches for “Epitaxy”; 4 quoted, at least 25 words apart.
…alone, we have announced six new products, including our Centura Prime Epi epitaxy system, designed specifically for high-performance DRAM. Producer Avila, that enables higher performance…
…per square foot of clean room space. One example is our new epitaxy system for DRAM that not only increases device performance, but also uses…
…had record revenues and deposition in Q3, including in PVD, CVD, and epitaxy, which is one of our fastest-growing businesses this year. In materials modification,…
…and power, including, I talked earlier on the call about very strong epitaxy growth, HBM packaging. We're the leader in materials deposition for wiring and…
Where the listed words were said
To ensure our supply chain and field teams can support their ramps, our largest customers are giving us longer-term commitments and rolling eight-quarter forecasts. This…
…margin of 30.1% up 280 basis points year-over-year. From a regional perspective, China represented 26% of our semiconductor systems plus AGS revenue. We now expect…
On Monday afternoon, October 12, we'll host an unveiling of the new EPIC Center in Silicon Valley, California. On Tuesday morning, October 13th, we hope…
And then relative to hybrid bonding, hybrid bonding is a way that every customer, whether it is leading-edge foundry logic or DRAM or high-bandwidth memory,…
…forecasts. During the quarter, we officially opened our newest manufacturing center in Singapore and, combined with other expansions worldwide, have nearly doubled our manufacturing space…
…DRAM, especially with AI, as we're expanding from training to inference to agentic AI to physical AI, memory demand continues to go higher. I'd say…
…leader in this market, with strong positions in high-bandwidth memory and 3D chiplet stacking, and we now expect our overall packaging revenues to grow more…
…partner to accelerate development of advanced chip packaging technologies for next generation AI systems. We also signed EPIC partnership agreements with SCREEN and UC Berkeley.
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